"fccl ed copper foil"

FCCL ED Copper Foil Quickly details Thickness: 0.012-0.070 mm Width: 5-520 mm Length: 500-5000 M ID: 76 mm,152 mm Alloy: T2,C11000,C1100,C101,E-Cu58 Temperature: High Features: 1. the treated foil in gray or red 2. High profile with properties of LP-S-B/R suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super

Width 520mm High Purity Red ED Copper Foil Features: 1. the treated foil in gray or red 2. High profile with properties suitable for FCCL 3. Grain structure of copper foil leads to high flexibility 4. Excellent etching performance 5. low profile enables to make fine circuit pattern Application: 1. Casting and lamination type FCCL 2. Super fine pattern FPC 3. Chip on flex (COF) for LED Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

FPC RA Copper Foil Description: Made of pure copper, copper grade T2(China), C1100(Japan), C11000(USA), E-CU58(Germany), CU-ETP(EU, ISO). Copper purity more than 99.95%. This is RA copper foil, one side is polished side and the other side is matte. We also have ED copper foil, ED copper foil can choose one side polished and double side polished. The ED copper can have a higher purity. welcome to contact us if you need it. Width, length, thickness all can be customized. we can

T2 Conductive High Temperature Copper Foil Sheet Roll Product Profile : We developed out there treated copper foil that has very low profile, this kind of copper foil is best for high frequency application.The surface treated copper foil, like 18um, 35um, 50um usually used in Multi-layer and double face FPCB construction, We also produce heavy ED copper foil, mainly for high current FPCB construction. Mechanical Properties Sheet: Quality Items General Technical Terms 1/3oz 1

Ductility EMI Shielding Rolled Pure RA Copper Foil Products Description Made of pure copper, copper grade T2(China), C1100(Japan), C11000(USA), E-CU58(Germany), CU-ETP(EU, ISO). Copper purity more than 99.95%. This is RA copper foil, one side is polished side and the other side is matte. We also have ED copper foil, ED copper foil can choose one side polished and double side polished. The ED copper can have a higher purity. welcome to contact us if you need it. Width, length,

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high bending resistance and good etching performance. Microstructure: Table1- Performance: Classification Unit 9μm 12μm 18μm 35μm Cu Content % ≥99.8 Area Weigth g/m2 80±3 107±3 153±5 283±7